IPC includes test methods for determining various SMT placement equipment attributes, including repeatability, accuracy and attribute de- fects. Each of. 3 Placement Performance Metric. Placement Performance Form IPCF1 . General Performance. Performance Validation. Find the most up-to-date version of IPC at Engineering
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Also, because of the pic of high-accuracy i. A single glass panel, referred to as the placement verification panel PVPhas been developed and standardized. Several standardized forms have been created to record measurement results. IPC combines placement rate and placement quality so speed and accuracy parameters depend on each other.
Placement Equipment Characterization Using IPC
Each PVP contains the following component types and quantities. These glass panels also must be certified using an internationally recognized standards institute.
Accuracy must be determined using a NIST-certified gauge, which in this case is a clear glass verification panel with selected component outlines etched into the glass. To measure placement machine capability accuracy, it is necessary to eliminate process variables introduced by other surface mount processes.
Optical CMMs are delicate instruments that require accurate calibration. The Reliability Performance form, which is completed by users, documents the reliability of factory-installed machines used in production. Each combination component and quantity is referred to as a component group: Five component types were selected to represent the full range of components placed by this type of equipment: It will reduce the effort required to evaluate and analyze surface mount placement machines, and it also should reduce disagreement between users and suppliers regarding equipment performance and functionality.
This document was developed to standardize the parameters, measurement procedures and methodologies used for the specification, evaluation and continuing verification of placement equipment parameters.
IPC Releases IPCA, Surface Mount Placement Characterization | IPC
This is accomplished by placing standardized components on clear glass panels that have been coated with a sticky media. Several years ago, the IPC — Association Connecting Electronics Industries sponsored an effort to develop a placement equipment evaluation model that would be accepted and used by placement machine suppliers and customers alike. The Placement Performance Metric form, which is completed by suppliers, reports general machine performance by model type and confirms the performance of a specific machine by serial number.
The accuracy and repeatability of the optical CMM must 9805 considerably better than the accuracy and repeatability of the placement machine being evaluated. Contact him at ; E-mail: This approach has two distinct advantages. Ipv this method is not an ideal simulation of an actual production environment, it was selected to eliminate as much assembly variation as possible so that it could be ip at various locations.
Although some commonality does exist, most suppliers historically have developed their own methods for establishing placement performance in terms of placement rate, accuracy, repeatability, etc.
Placement Equipment Characterization Using IPC-9850
Lack of a common, industry-wide benchmarking methodology makes placement machine analysis difficult and time-consuming for suppliers and users. This long overdue document will benefit everyone. A clear glass substrate coated with a sticky media is used for component mounting. Second, because the glass panel is transparent, an optical coordinate measuring machine CMM can illuminate the component outline, making accurate measurement possible.
Capacitors were selected over resistors because the outside edges are more precise and geometrically accurate. To ensure the desired level of accuracy and repeatability, glass slugs are used to represent the more complex devices.
Placement equipment evaluations always have been confusing and complicated. They also are environment sensitive, so they must be used in a controlled environment. This document can be purchased directly from the IPC www.
Both components are economical and available in tape-and-reel, which are key attributes. The SOIC component was selected because it is robust and accurately represents a broad family of coarse-pitch components. IPC creates a common method for establishing the performance capability of machines used to place surface mount components. It also is necessary to minimize material variation due to component quality, component packaging format and substrate quality.