Single Pulse. D= DSEI 2x t [s]. I F. [A. ] -diF /dt [A/µs]. VF [V]. Q r. [µ. C]. -diF /dt [A/µs]. I RM. [A. ] -diF /dt [A/µs]. -diF /dt [A/µs]. DSEI 2X A IXYS Rectifiers datasheet, inventory, & pricing. IXYS DSEI-2XA Rectifiers are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for IXYS DSEI-2XA Rectifiers.

Author: Nisida Malagul
Country: Austria
Language: English (Spanish)
Genre: Technology
Published (Last): 15 October 2004
Pages: 277
PDF File Size: 1.4 Mb
ePub File Size: 7.12 Mb
ISBN: 188-2-49354-166-1
Downloads: 96673
Price: Free* [*Free Regsitration Required]
Uploader: Guzuru

Life support applicationsIXYS products used in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to re-sult in personal injury must be expressly authorized for such purposes.

Thus, in general, none of the series diodes will be overstressed by reverse voltages which are substantially above the avalanche voltage. The module housing is designed for adequate clearance and creepage distance resulting in recognition by Underwriters Laboratories, Inc. The outline of SimBus A goes with the industrial standard height of 17 mm, the general tendency for power modules The maximum junction temperature has been extended to C due to the technological improvements.

The design and manufacture of discrete semiconductors and silicon assemblies, including single and multiphase, uncontrolled and fully controlled rectifiers, bridges and isolated base power modules, naturally, air or liquid cooled. Likewise a negative temperature coefficient is when the devices CE sat reduces when the junction datasheett increases.

Isolation capability from leads to backside RMS no exterl isolation foil needed Thermal resistance from Junction satasheet Case only slightly higher as for nonisolated version Increased power- and temperature cycling capability DCB can be datasheett like printed circuit boards allowing special functions to be realized DCB Mould Copper Ceramic Copper Solder Example: All thyristor modules with DCB ceramic base contacts are available in volume with two standardized twin plugs 2.

Surge suppression and fusing can be added to protect the devices from voltage transients and short circuits. Datzsheet improved thermal resistance is the result of the optimized connection of the DCB and the copper base plate. This makes these parts a simple and economical path to upgrade or refurbish equipment that previously used GTOs, such as locomotives or medium voltage drives.


dsei60 06a pdf printer

Ideally suited to application including: No minimum contract term. The device s high voltage level-shift technique enables it to operate at up to These parts are particularly suitable for use as anti-parallel diodes in Gate Turn-Off thyristors and Fast Thyristor inverters, diodes for choppers. Utilities scale converters O T j Max No.

The square reverse bias safe operating area RBSOA feature of this family insures safe operation in snubberless, hard switching applications.

Pressure can be applied in different ways, for example using a mounting clip or a post, applying pressure via the PCB directly to the power device see Fig. The gate driver output typically can source mA and sink mA, which is suitable for fl uorescent lamp ballast, motor control, SMPS, and other converter drive topologies.

Datasheet «DSEI 2×101»

datwsheet If heat sinking is required designers have to look for solutions providing isolation and creepage di-stance. October 29, for the Accredited Unit: This behaviour has a direct influence on the design of the 0a6 filter networks with its capacitors and inductors of which the size and costs can be reduced.

Girl chat group names Girl chat group names Girl chat group names I sure your curiosity power is awesome. Devices are available with blocking voltages from up to 6k. Spring contacts for the gate terminals offer a solder-free connection of the control-board.

In additional to power semiconductor assembly, we can offer complementary sub-assemblies to our customer s requirements, such as fuse panels and capacitor banks as well as contract manufacture to your designs. Principal applications are static converter circuits for speed control of DC-drives, or switching datashet control functions for temperature, lighting, soft-start, etc.

These assemblies are available on short leadtimes to suit most common line voltages and current ratings from 35 A to 15 ka.


DSEI2XA DIODE FRED V 2XA SOT IXYS datasheet pdf data sheet FREE from

Complementary gate drives, mounting clamps and passive components available. PolarP2 Standard versions are available with drain current ratings of 16A, 24A, 42A, 52A and are tailored to provide designers the best compromise between performance and cost.

Girl chat group names Girl chat group names I sure your curiosity power is awesome. Stress above one or more of the limiting datashee may cause permanent damage to the device.

Selectorguide | Francisco Almeida –

This behaviour has a direct influence on the design of the EMI filter networks with its capacitors and inductors of which the size and costs can be reduced. O W13 Weight g W14 Weight g 2c101 is designed for high power microwave applications, operating.

SimBus A is a module conception for easy and fast mounting. It also gives the maximum current rating and lowest thermal resistance 2×1011 the package size. ISOPLUS-SMPD -B 1 is optimized for implementing more complex configurations like phase-legs, buck and boost chopper as well as single or 3-phase input rectifier bridges, which can ideally be used as building blocks for inverters.

Exposure to limiting values for extended periods may affect device reliability. Can you speak up a little. O W13 Weight g W14 Weight g IXYS has also reduced the wafer thickness, which substantially reduces the thermal resistance. IXYS Polar HiPerFETs combine the strengths of the Polar Standard product family with a faster body diode, whose reverse recovery time trr is reduced to make them suitable for phase-shift bridges, motor control and uninterruptible power supply applications UPS.

As normal these devices require a layer of thermal interface material heat transfer paste to be applied to the backside of the power devices or to the heat sink surface alternatively. This also gives significant benefits when series or parallel connection of devices is required.