Find the most up-to-date version of JEDEC JESD at Engineering Environmental Acceptance. Requirements for Tin Whisker. Susceptibility of Tin and Tin Alloy. Surface Finishes. JESD MARCH JEDEC SOLID STATE . JEDEC standard JESD22A, Measuring Whisker Growth on Tin and Tin Alloy The JEDEC standard JESD , Environmental Acceptance.

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Standards & Documents Search

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry. Current search Search found 210 items. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted.

The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry. Registration or login required. Solid State Memories JC It should aid the technical committees jedd JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions.

Filter by document type: Show 5 results per page. The predominant terminal finishes on electronic components have been Sn-Pb alloys. Additional requirements may be specified in the appropriate requirements procurement documentation.

Current search Search found 9 items. External visual is a noninvasive and nondestructive test. Reaffirmed May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished package or component. Search by Keyword or Document Number. This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only available data is based on tests performed at accelerated stress test conditions. This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available.

All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted. Filter by document type: Learn more and apply today. This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation.

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The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry 21 s: The method to be used is the Sum-of-the-Failure-Rates method. Multiple Chip Packages JC It does not define the quality and reliability requirements that the component must satisfy. Quality and Reliability of Solid State Products filter.

It establishes a set of data elements that describes the component and defines what each element means. Solid State Memories JC The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. It is functional for qualification, quality monitoring, and lot acceptance. Reaffirmed May JESDA Sep The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers.

It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions. This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed.

Additional requirements may be specified in the appropriate requirements procurement documentation. The potential effectiveness of various mitigation practices will also be briefly discussed. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag.

Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. Terms, Definitions, and Symbols filter JC This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now hesd. This standard establishes the information required by semiconductor users from IC manufacturers and distributors in order to judge whether a semiconductor component is fit for use in their particular application.

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The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry Committee s: This methodology may not be sufficient for applications with special requirements, i.

This methodology may not be sufficient for applications with special requirements, i. This publication jead the LTS requirements of wafers, dice, and packaged solid-state devices.

Standards & Documents Search | JEDEC

This publication also provides guidance in the selection of reliability modeling parameters, namely functional form, apparent thermal activation energy values and sensitivity to stresses such as power supply voltage, jeds current, current density, gate voltage, relative humidity, temperature cycling range, mobile ion concentration, etc.

Terms, Definitions, and Symbols filter JC As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and jsd of Sn, including Sn-Bi and Sn-Ag Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts. Search by Keyword or Document Number. References behind each of the theories and mitigation practices are provided.

Registration or login required. Displaying 1 – 9 of 9 documents. Multiple Chip Packages JC